LED lighting industry to bring the experience of the six modes

The so-called "non-encapsulated chip" device chip scale package (CSP) are known, because there is no stand no gold and other characteristics, showing a packaged chip have unmatched stability and flexibility, and lower thermal resistance, smaller and other advantages, gradually being optimistic about the industry. No packaged chip, chip companies as a downstream product of Nobu, the existing LED industry chain to form a huge challenge. No packaged chip birth lighting companies will bring new models and experience:

 

1, chip companies and lighting companies direct docking, direct shortened chain;

 

2, production conditions and technical requirements to reduce, reduce investment costs of production and plant;

 

3, the lighting design is not longer limited to a light source of randomness allows lighting designers unlimited play;

 

4, can be freely combined into different power source specification, flexible application;

 

5. The composition of mix and match different color temperature of the light source, to further reduce inventory;

 

6, the light source may need to self-scheduling, so that timely delivery guaranteed.

 

But has been packaged chip applications without expensive equipment, hindering the development of non-packaged chip. On the non-dimensional photoelectric packaged chips, chip package developed no special placement equipment with independent intellectual property rights, and the device is less than one tenth the cost of imported equipment. Through the use of high-volume production, the formation of a set of non-packaged chip application solutions, including non-packaged chip dedicated chip equipment, experimental data, the solder and the substrate, technical training, worry-free after-sales service.

 

Lighting companies can build applications based on non-packaged chip solution without the packaged chip chip production lines, lighting companies and chip companies to make direct docking, the real integration of industrial chain. After no packaged chip wide range of applications, the cost advantage will become increasingly large, social will be evident.

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